问题描述：
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3.Previous Working Experience
2002.10-2006.5
Company:China Resource Micro-Assembly Tech.,Ltd?
Company Property:Joint Venture
Company Size:2000 employees around
Company Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCC
Position:Equipment engineer( Singulation)
( GPM,ASM,YAMADA,TOWA,高柏斯,三佳)
Job Description as below:
The new material evaluation,In charge of spare part control.
Maintain,install,troubleshoot and repair of equipment tooling.
Assist in developing new device/package start-up.
Assist in equipment improvement/equipment upgrading plan.
Weekly,monthly,yearly,issue the engineering performance report to manager as soft copy.
2001.7-2002.2
Company:China resource microelectronic (Holdings) limited
Company Property:Joint Venture
Company Size:8000 employees around
Company Products:Transistor
Position:Technician (Die attached,Plating)
Job Description as below:
Maintain the machine daily.
Handle the tooling sourcing and management,issue PR to purchasing department.
Assist with process engineer to achieve the necessary yield.
4.Education
1998.9-2003.7,JSIT.
Jiangsu College of Information Technology.
Major in:Integrated Circuit Manufacturing Technology.
Main Subject as bellow:
Physics of Semiconductor Devices.
Ultra large scale (ULC) integrated circuit process.
Bonding technique of integrated circuit/discrete device.
Foundation of Circuit.
Thin/Thick Film Integrated Circuit Process.
Electronic Application Technology.
Analog integrated circuit.
C Language etc…
5.Certification
Certification Institution:China Information industry Ministry
Senior Engineer---Semiconductor chip manufacture.
Senior Engineer--- Senior Engineer--Semiconductor Assembly Process & Application.
Certification Institution:Gallant Micro Machining Corporation
Mold Manufacturing & Assembling Intern Diploma Certification.
3.Previous Working Experience
2002.10-2006.5
Company:China Resource Micro-Assembly Tech.,Ltd?
Company Property:Joint Venture
Company Size:2000 employees around
Company Products:QFP、SOP、HSOP、LQFP、DIP、SSOP、PLCC
Position:Equipment engineer( Singulation)
( GPM,ASM,YAMADA,TOWA,高柏斯,三佳)
Job Description as below:
The new material evaluation,In charge of spare part control.
Maintain,install,troubleshoot and repair of equipment tooling.
Assist in developing new device/package start-up.
Assist in equipment improvement/equipment upgrading plan.
Weekly,monthly,yearly,issue the engineering performance report to manager as soft copy.
2001.7-2002.2
Company:China resource microelectronic (Holdings) limited
Company Property:Joint Venture
Company Size:8000 employees around
Company Products:Transistor
Position:Technician (Die attached,Plating)
Job Description as below:
Maintain the machine daily.
Handle the tooling sourcing and management,issue PR to purchasing department.
Assist with process engineer to achieve the necessary yield.
4.Education
1998.9-2003.7,JSIT.
Jiangsu College of Information Technology.
Major in:Integrated Circuit Manufacturing Technology.
Main Subject as bellow:
Physics of Semiconductor Devices.
Ultra large scale (ULC) integrated circuit process.
Bonding technique of integrated circuit/discrete device.
Foundation of Circuit.
Thin/Thick Film Integrated Circuit Process.
Electronic Application Technology.
Analog integrated circuit.
C Language etc…
5.Certification
Certification Institution:China Information industry Ministry
Senior Engineer---Semiconductor chip manufacture.
Senior Engineer--- Senior Engineer--Semiconductor Assembly Process & Application.
Certification Institution:Gallant Micro Machining Corporation
Mold Manufacturing & Assembling Intern Diploma Certification.
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