问题描述：
请熟悉计算机的英文高手翻译200字左右的说明,谢谢!
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
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This document provides guidelines for the proper power delivery design for Hi-Speed USB ports and front panel headers on motherboards. The material covered here is broken up into three main categories: designing for droop test, designing for drop test, and front panel I/O considerations. High speed USB operation is described in the USB Specification Revision 2.0 and USB signal routing on a 4-layer motherboard is described in the High speed USB Platform Design Guidelines
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This paper is intended as a guide in designing power delivery for USB ports on motherboards. The paper addresses the most common issues causing USB-IF electrical test failures and design methods to prevent such problems.
For motherboard and system compliance testing, please contact one of the Independent Test Labs. For the latest information on USB-IF Compliance testing and test requirements, please visit the USB-IF Compliance Program web site.
这是intel关于USB规范的相关说明,需要准确的翻译,谢谢!
这么快！？你怎么做到的？牛啊！
您能提供一个“自动翻译”的网址吗？谢谢！！
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
.
This document provides guidelines for the proper power delivery design for Hi-Speed USB ports and front panel headers on motherboards. The material covered here is broken up into three main categories: designing for droop test, designing for drop test, and front panel I/O considerations. High speed USB operation is described in the USB Specification Revision 2.0 and USB signal routing on a 4-layer motherboard is described in the High speed USB Platform Design Guidelines
.
This paper is intended as a guide in designing power delivery for USB ports on motherboards. The paper addresses the most common issues causing USB-IF electrical test failures and design methods to prevent such problems.
For motherboard and system compliance testing, please contact one of the Independent Test Labs. For the latest information on USB-IF Compliance testing and test requirements, please visit the USB-IF Compliance Program web site.
这是intel关于USB规范的相关说明,需要准确的翻译,谢谢!
这么快！？你怎么做到的？牛啊！
您能提供一个“自动翻译”的网址吗？谢谢！！
问题解答：
我来补答展开全文阅读